Heat-Assisted Magnetic Recording Device Market to Hit US$ 389.15 Million By 2031 | Latest Insights
Heat-Assisted Magnetic Recording Device Market is projected to register a CAGR of 37.10% during 2023-2031, due to its increasing demand…
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Resonac enters mass production of new-gen SiC epi-wafers for EVs
Japan-based Resonac, formerly Showa Denko, kicked off volume production of its new-generation 6-inch SiC epi-wafers on March 1, aiming to…
Infineon and Resonac announced a new multi-year agreement for delivery of SiC materials
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